Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology B, Vol.17, No.5, 2193-2193, 1999 Export Citation Low temperature metalorganic chemical vapor deposition of tungsten nitride as diffusion barrier for copper metallization (vol B17, pg 1101, 1999) Kelsey JE, Goldberg C, Nuesca G, Peterson G, Kaloyeros AE, Arkles B Please enable JavaScript to view the comments powered by Disqus.
