Projection electron-beam lithography, specifically the scattering with angular limitation projection electron lithography (SCALPEL) system, is a viable technology for the production of semiconductor devices with feature sizes in the sub-0.13 mu m regime. A step-and-scan approach is used to expose the patterned membrane areas within the grillage structure on the SCALPEL mask.;Finite element methods were employed to determine the dynamic distortions caused by an acceleration duty cycle and by various mounting techniques. The transient response of a SCALPEL mask with and, without a support ring has been analyzed. Results for both an electrostatic chuck and a "3-2-1" kinematic mount are presented. They show the electrostatic mount produces significantly lower distortions than the 3-2-1 kinematic mount with a support ring.;