Experimentally determined two-dimensional dopant maps of implants into semiconductors required for the calibration and verification of process simulation tools used in very large scale integrated (VLSI) circuit design. Direct measurement with currently available techniques is not possible owing to the physical size of the areas in question. Using a specially fabricated structure and a modified secondary-ion mass spectroscopy instrument, it has been possible to measure profiles with high spatial resolution and sensitivity. In this article we present the results of an investigation of a complex boron implant into silicon, as used in advanced VLSI P-type metal-oxide-semiconductor source-drain regions, and compare it with results from process simulators.