Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology B, Vol.13, No.2, 183-191, 1995 DOI10.1116/1.587995 Export Citation Simulations of Trench-Filling Profiles Under Ionized Magnetron Sputter Metal-Deposition Hamaguchi S, Rossnagel SM Keywords:EVOLUTION;PLASMA Please enable JavaScript to view the comments powered by Disqus.
