Fabrication of GaN devices presents a number of processing issues. Since the AlGaN/GaN material and sapphire substrates are transparent in the ultraviolet, light scattering can degrade the quality of the lithography. GaN and AlGaN are chemically inert materials, highly resistant to wet etching. Schottky contacts are fabricated with noble metals (Pt, Au) which present adhesion problems. The approaches to solving these difficulties and the routes to fabrication of high performance GaN-based modulation doped field effect transistors are presented. The light scattering has been addressed by the deposition of amorphous Si on the backside of the wafers, Mesa etching For device isolation has been performed with both chemically assisted ion beam etching and a newly developed wet etching technique. Finally, metal adhesion has been greatly improved by the initial deposition of a thin sputtered Pt layer, followed by a thick layer of Pt/Au by e-beam evaporation. A 100 mu m wide device showed a maximum de current density of 946 mA/mm, a peak transconductance of 160 mS/mm, a short circuit current gain cutoff frequency of 15.6 GHz, and a maximum oscillation frequency of 49.4 GHz.