Journal of Vacuum Science & Technology A, Vol.17, No.4, 1635-1638, 1999
Low-energy electron diffraction study of the multilayer relaxation of Cu(211)
The multilayer relaxation of Cu(211) at 110 K was determined by a dynamical low-energy electron diffraction study. This study indicates that the first and second interlayer spacings are contracted by 0.11+/-0.03 Angstrom (15+/-4%) and 0.08+/-0.03 Angstrom (11+/-4%), respectively, while the third interlayer spacing is expanded by 0.06+/-0.03 Angstrom (8+/-4%). These results compare well with the predictions of two theoretical studies of this surface [C. Y. Wei, S. P. Lewis, E. J. Mele, and A. M. Rappe, Phys. Rev. B 57, 10062 (1998); S. Durukanoglu, A. Kara, and T. S. Rahman, Phys. Rev. B 55, 13894 (1997)].
Keywords:SURFACE RELAXATIONS;THERMAL-EXPANSION;METAL-SURFACES;RELIABILITY FACTORS;AG(111);CU(511);MODEL