화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Journal of Industrial and Engineering Chemistry, Vol.106, 198-204, February, 2022
DOI10.1016/j.jiec.2021.10.027  Export Citation
Brightener breakdown at the insoluble anode by active chlorine species during Cu electrodeposition
Da Jung Park1, Myeongjin Han1, 2, Mi Jung Park3, Joo-Yul Lee1, and Seunghoe Choe1, †
  • 1Surface Technology Division, Korea Institute of Materials Science (KIMS), 797 Changwondaero, Seongsan-gu, Changwon, Gyeongsangnam-do 51508, Republic of Korea
  • 2Department of Materials Science and Engineering, Pusan National University, 2 Busandaehak-ro 63 beongil, Busan 46241, Republic of Korea
  • 3Wesco Electrode Company Limited, Changwon 51561, Republic of Korea
E-mail:
It is highly important to design and develop appropriate insoluble anodes for industrial Cu electroplating to lower the amount of organic additives that this process consumes. Conventionally, this rapid consumption of additives (e.g., brighteners, suppressors, or levelers) is known to be due to the active radical species (e.g., ·OH) formed during oxygen evolution. In this study, we found that trace amounts of chloride ions present in the electroplating bath are the source of the active chlorine species that accelerate the breakdown at the insoluble anode. A sacrificial, perfluorinated polymer coating effectively decreased the emission of active chlorine species from the electrode, thereby lowering the consumption of the brightener. This study reveals that the suppression of chlorine evolution at the anode can be an effective approach for decreasing brightener consumption during Cu electrodeposition.
Keywords:Insoluble anode;Copper;Electrodeposition;Organic additive;Additive decomposition
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