The decay of optically generated excess charge carriers at the heterointerface between crystalline silicon and amorphous silicon has been monitored in situ during plasma deposition of the amorphous layer. A dramatic increase in the interface recombination rate is seen instantly when the silane plasma is ignited. In a later stage of amorphous layer deposition, the recombination rate decreases. This interface passivation depends strongly on the substrate temperature and is more efficient at higher temperature and in the presence of silane plasma. The effect is not due to a change in the band bending at the heterointerface.