Previous Article Next Article Table of Contents Journal of Vacuum Science & Technology A, Vol.12, No.6, 3239-3241, 1994 DOI10.1116/1.579244 Export Citation Coupling of Radiofrequency Bias Power to Substrates Without Direct-Contact, for Application to Film Deposition with Substrate Transport Smith DL, Alimonda AS Keywords:PLANAR Please enable JavaScript to view the comments powered by Disqus.
