A study was made of the copper corrosion rate and corrosion products originated by the action of acetic acid vapor at 100% relative humidity. Copper plates were exposed to an acetic acid contaminated atmosphere for a period of 21 days. Five acetic vapor concentration levels were used. The copper corrosion rate was in the range of 1 to 23 mg/dm(2) day. The corrosion-product layers were characterized using electrochemical, X-ray powder diffraction, Fourier transform infrared spectrometry, and scanning electron microscopy techniques. Thermal and calorimetric studies were also performed. Some of the compounds identified were cuprite (Cu2O), copper acetate hydrate [Cu(CH3COO)(2). 2H(2)O], and copper hydroxide acetate [Cu-4(OH)(CH3COO)(7). 2H(2)O]. This last compound was also characterized. The thickness of the patina layers was 4 to 8 nm for amorphous cuprite, 11 to 18 nm for cuprite, and 225 nm for copper acetate. The patina, in which the cementation process of different corrosion-product layers plays an important role, is formed by the reaction of acetic vapor with copper through porous cuprite paths.