Displacement deposition of tin on Si from fluoride solutions results only in small scattered grains on the surface. However, deposition on a Pd predeposited Si substrate greatly increases the amount of deposited tin. Using morphological and chemical surface analysis, we conclude that Sn deposition occurs on the surface of the substrate placed in between the previously deposited Pd grains. Depending on the distribution of the Pd nuclei on the substrate, a complete surface coverage by nanometric particles of metallic tin can be achieved.