Multifunctional adhesives out of a polymer matrix and electrically conductive fillers are known to typically decrease in bond strength with increasing filler content, while the electrical resistance drops extensively at the percolation threshold. Three experiments have focused on different aspects of the production of electrically conductive adhesive wood bonds, experiment I with a variation of the adhesive components, experiment II is varying the process parameters in the bonding process, and experiment III is investigating a thermal postcuring effect. Tensile shear strength (EN 302-1, requirement for structural wood bonding dry condition (A1 treatment)) and electrical resistography under direct current (DC measurements) of the bondline was used to identify major influences on tensile shear strength and the formation of the electrically conductive network. The results show high differences due to the adhesive polymer selection, the filler type and some of the process parameters. As an example, it was revealed that the bond strength of multifunctional adhesive wood joints can be increased by integrating increasing contents of carbon nanotubes in polyurethane prepolymers, if the polymers do not contain fibrous fillers before the dispersion.