Moisture diffusion and reaction chemistry in polymeric materials affect the mechanical properties, chemical compatibility, and durability of the materials. The ability to model reaction kinetics within materials can facilitate material selection and predict long-term performance. In this study, low-field nuclear magnetic resonance T-2 relaxometry and magnetic resonance imaging (MRI) were used to measure the curing kinetics of a commercially available water-reactive silicone adhesive material. Relaxation times were measured at four different temperatures from 25 to 60 degrees C and three different water vapor concentrations. The single-step autocatalytic Sestak-Berggren (S-B) reaction model was used to model the reaction kinetics. An activation energy of 3.7 kJ/mol was estimated using the S-B model and confirmed by isoconversional analysis. The cure rate was found to vary with the water vapor concentration, and an empirical linear relationship between the water vapor concentration and kinetic rate constant was determined. MRI was used to corroborate the autocatalytic reaction model.