The physical aging behavior, time-dependent densification, of thin polystyrene (PS) films supported on silicon are investigated using ellipsometry for a large range of molecular weights (MWs) from M-w = 97 to 10,100 kg mol(-1). We report an unexpected MW dependence to the physical aging rate of h < 80-nm thick films not present in bulk films, where samples made from ultra-high MWs >= 6500 kg mol(-1) exhibit on average a 45% faster aging response at an aging temperature of 40 degrees C compared with equivalent films made from (merely) high MWs <= 3500 kg mol(-1). This MW-dependent difference in physical aging response indicates that the breadth of the gradient in dynamics originating from the free surface in these thin films is diminished for films of ultra-high MW PS. In contrast, measures of the film-average glass transition temperature T-g(h) and effective average film density (molecular packing) show no corresponding change for the same range of film thicknesses, suggesting physical aging may be more sensitive to differences in dynamical gradients. These results contribute to growing literature reports signaling that chain connectivity and entropy play a subtle, but important role in how glassy dynamics are propagated from interfaces. (c) 2019 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2019, 57, 1224-1238