CVD 장비 Up Time 향상을 위한 기판 지지대의 재질 및 구조 최적화

우람; 김원; Ram Woo; Won Kyung Kim

Korean Journal of Materials Research, Vol.29, No.11, 670-676, November, 2019

DOI10.3740/MRSK.2019.29.11.670 Export Citation

CVD 장비 Up Time 향상을 위한 기판 지지대의 재질 및 구조 최적화

Material and Structure Optimization of Substrate Support for Improving CVD Equipment Up Time

우람, 김원^{1, †}

인제대학교 나노융합공학부
¹경북대학교 나노소재공학부

Ram Woo, and Won Kyung Kim^{1, †}

School of Nano Engineering, Inje University, Gimhae-si, Gyeongsangnam-do 50834, Republic of Korea
¹School of Nano & Materials Science and Engineering, Kyungpook National University, Gyeongsangbuk-do 37224, Republic of Korea

E-mail:

We study substrate support structures and materials to improve uptime and shorten preventive maintenance cycles for chemical vapor deposition equipment. In order to improve the rolling of the substrate support, the bushing device adopts a ball transfer method in which a large ball and a small ball are mixed. When the main transfer ball of the bushing part of the substrate support contacts the substrate support, the small ball also rotates simultaneously with the rotation of the main ball, minimizing the resistance that can be generated during the vertical movement of the substrate support. As a result of the improvement, the glass substrate breakage rate is reduced by more than 90 ~ 95 %, and the equipment preventive maintenance and board support replacement cycles are extended four times or more, from once a month to more than four months, and the equipment uptime is at least 15 % improved. This study proposes an optimization method for substrate support structure and material improvement of chemical vapor deposition equipment.

Keywords:substrate support;chemical vapor deposition(CVD);bushing;ball transfer

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[1] Kern W, J. Electrochem. Soc., 137, 1887 (1990)

[2] Davis RW, Moore EF, Zachariah MR, J. Cryst. Growth, 132, 513 (1993)

[3] Neamen DA, Semiconductor Physics and Devies; 3rd Edition, p. 210-217, McGraw-Hill, McGraw-Hill Press, New York (2011).

[4] Nam KW, Shin KH, Jung SO, Kim HJ, Proceedings of the Korean Society of Precision Engineering., Jeju, Korea (2012).

[5] Kasap SO, 3rd Edition, p. Ch5.16-5.18, McGraw-Hill, New York (2017).

[6] Burkman DC, Peterson CA, Zazzera LA, Kopp RJ, Microcontamination, 6, 57 (1988)

[7] Khilnani A, Particles on Surfaces 1: Detection, Adhesion, and Removal, p. 129-142, Plenum, Plenum Press, New York (1988).

[8] Slusser GJ, MacDowell L, J. Vac. Sci. Technol. A, 5, 1649 (1987)

[9] Monkowski JR, Treatise on Clean Surface Technology, p. 123-148, Plenum, Plenum Press, New York (1987).

[10] Kern W, Schnable GL, p. 225-280, Chapman and Hall, New York (1987).

[11] Licciardello A, Puglisi O, Pignataro S, Appl. Phys. Lett., 48, 41 (1986)

[12] Ruzyllo J, Kamieniecki E, Real-time in-line testing of semiconductor wafers, US Patent, 5[661] 408 (1997).

[13] Eisele KM, Klausmann E, Solid State Technol., 27, 177 (1984)

[14] Stacy WT, Allison DF, Wu TC, p. 344, in Proceedings of the Journal of the Electrochemical Society., Pennington, NJ (1981).

[15] Schmidt PF, Pierce CW, J. Electrochem. Soc., 128, 630 (1981)

[16] Korean Intellectual Property Office, 10-2014-0139935.

[17] Korean Intellectual Property Office, 10-2015-0125378.

[18] Korean Intellectual Property Office, 10-2019-0004973.

[19] Korean Intellectual Property Office, 10-1296966.

[20] Kim WD, Han DC, J. KSLE. Soc., 8, 64 (1992)

[21] Rokkaku K, JSPE. Soc., 54, 28 (1987)

[22] Wedeven LD, Harris T, Machine Des., 59, 72 (1987)

[23] Kim WD, J. KSLE. Soc., 7, 7 (1991)

[24] Choi IH, Park CN, Choi HJ, Lee JK, Shin DW, p. 119.126 in Proceedings of the Korean Society of Tribologists And Lubrication Engineers., Daegu, Korea (1999).

[25] Kim BM, Kim SS, Shin DW, Yoon SB, p. 296-300 in Proceedings of the Korean Society of Tribologists And Lubrication Engineers., Daegu, Korea (2004).

[26] Aramaki H, Shoda Y, Morishita Y, Sawamoto T, J. Trib. Soc., 110, 693 (1988)

[27] Kim BM, Kim SS, Shin DW, Yoon SB, p. 193.198 in Proceedings of the Korean Society of Tribologists And Lubrication Engineers., Daegu, Korea (2004).

[28] Ban JE, Kim KW, J. KSLE. Soc., 14, 26 (1998)

[29] Jang ST, Lee YZ, J. KSLE. Soc., 11, 11 (1995)