유연전극 응용을 위한 구리기반 고체상태 전기전도성 잉크의 안정성과 전기적 특성

최범순; 강호종; 이동현; Beom Sun Choy; Ho-Jong Kang; Dong Hyun Lee

Polymer(Korea), Vol.43, No.5, 771-777, September, 2019

DOI10.7317/pk.2019.43.5.771 Export Citation

유연전극 응용을 위한 구리기반 고체상태 전기전도성 잉크의 안정성과 전기적 특성

Stability and Electrical Conductivity of Copper-based Solid-state Conductive Inks and Their Application for Flexible Electrodes

최범순, 강호종, 이동현^†

단국대학교 고분자공학과

Beom Sun Choy, Ho-Jong Kang, and Dong Hyun Lee^†

Department of Polymer Science and Engineering, Dankook University, 152 Jukjeon-ro, Suji-gu, Yongin-si, Gyeonggi-do 16890, Korea

E-mail:

초록

본 연구에서는 전기전도층을 형성하기 위해 구리 전구체 기반의 고체상태 잉크를 제조하였다. 구리 전구체는 유기용매 상에서 알킬아민과 함께 복합체를 형성하여 안정화되었으며, 이후 유기용매를 고체상태의 파라핀 왁스로 치환하여 전도성 잉크를 제조하였다. 시간에 따라 기존의 액체상태 잉크와 달리 고체상태 잉크는 구리 전구체-알킬아민 복합체가 분리되지 않고 오랜 시간 유지 및 보관 가능하다는 결과를 적외선 분광법을 통해 확인하였다. 잉크를 소결하여 제조된 구리 전도층은 전류-전압 곡선 및 면저항을 측정하여 전기적 특성을 확인하였다. 잉크의 인쇄 가공성을 확인하기 위하여 사용된 파라핀 왁스들의 용융점, 열분해온도 및 점도 등의 물성을 각각 시차 주사 열량측정법, 열중량 분석법 및 유변물성 측정을 진행하였다. 끝으로, 제조된 전도성 고체 잉크를 인쇄공정을 통한 패턴제조에 응용하기 위하여 고분자 기판에 구리패턴을 제조하여 굽힘 시험을 통해 유연 전극으로의 가능성을 확인하였다.

In this study, we fabricate a unique and versatile copper precursor-based solid-state ink for potential application to flexible electrodes. Initially, copper (II) formate tetrahydrate as a copper precursor is stabilized in organic solvent (toluene) by the ionic complex of alkylamine (octylamine) molecules. The copper solid-state ink is then produced by exchanging the organic solvent with four different types of paraffin wax with solution casting method. The copper solid-ink is successfully transformed to copper layer as it is thermally treated at temperatures of more than 150 oC for various sintering times. Current-voltage (I-V) curves and sheet resistance are measured to confirm the electrical conductivity of copper layers formed from the solid-state ink. DSC, TGA, and rheometry experiments are also conducted to find thermal and rheological properties of the solid ink. In addition, mechanical bending tests of the copper layer printed on polymeric substrates are conducted to find its potential possibility as flexible electrodes.

Keywords:copper;conductive ink;solid-state;paraffin wax;flexible electrodes

[References]

Kamyshny A, Magdassi S, Small, 10, 3515 (2014)
Okimoto H, Takenobu T, Yanagi K, Miyata Y, Shimotani H, Kataura H, Iwasa Y, Adv. Mater., 22(36), 3981 (2010)
Lee D, Go S, Hwang G, Chin BD, Lee DH, Langmuir, 29, 12259 (2013)
Park S, Vosguerichian M, Bao Z, Nanoscale, 5, 1727 (2013)
Hu LB, Hecht DS, Gruner G, Chem. Rev., 110(10), 5790 (2010)
Jeong S, Song HC, Lee WW, Lee SS, Choi Y, Son W, Kim ED, Paik CH, Oh SH, Ryu BH, Langmuir, 27(6), 3144 (2011)
Choi YH, Hong SH, Langmuir, 31(29), 8101 (2015)
Yabuki A, Arriffin N, Yanase M, Thin Solid Films, 519(19), 6530 (2011)
Grouchko M, Kamyshny A, Magdassi S, Materials, 3, 4626 (2010)
Azoubel S, Shemesh S, Magdassi S, Nanotechnology, 23, 344003 (2012)
Magdassi S, Grouchko M, Berezin O, Kamyshny A, ACS Nano, 4, 1943 (2010)
Huang K, Tsukamoto H, Yong Y, Chiu H, Nguyen MT, Yonezawa T, Liao Y, RSC Adv, 7, 25095 (2017)
Lee B, Kim Y, Yang S, Jeong I, Moon J, Curr. Appl. Phys., 9(2), E157 (2009)
Wunscher S, Abbel R, Perelaer J, Schubert US, J. Mater. Chem. C, 2, 10232 (2014)
Gao Y, Zhang H, Jiu J, Nagao S, Sugahara T, Suganuma K, RSC Adv., 5, 1155 (2017)
Farraj Y, Grouchko M, Magdassi S, Chem. Commun., 51, 1587 (2015)
Galwey AK, Jamieson D, Brown ME, J. Phys. Chem., 78, 2664 (1974)
Park S, Moon HC, Lee DH, RSC Adv., 6, 50158 (2016)
Lee JH, Chung BH, Park SH, Moon HC, Lee DH, Macromol. Res., 26(2), 157 (2018)
Huang S, Liu Y, Zhao Y, Ren Z, Guo CF, Adv. Funct. Mater., 29, 180592 (2019)
Kim W, Lee S, Lee DH, Park IH, Bae JS, Lee TW, Kim JY, Park JH, Cho YC, Cho CR, Jeong S, Sci. Rep., 5, 10715 (2015)

[1] Kamyshny A, Magdassi S, Small, 10, 3515 (2014)

[2] Okimoto H, Takenobu T, Yanagi K, Miyata Y, Shimotani H, Kataura H, Iwasa Y, Adv. Mater., 22(36), 3981 (2010)

[3] Lee D, Go S, Hwang G, Chin BD, Lee DH, Langmuir, 29, 12259 (2013)

[4] Park S, Vosguerichian M, Bao Z, Nanoscale, 5, 1727 (2013)

[5] Hu LB, Hecht DS, Gruner G, Chem. Rev., 110(10), 5790 (2010)

[6] Jeong S, Song HC, Lee WW, Lee SS, Choi Y, Son W, Kim ED, Paik CH, Oh SH, Ryu BH, Langmuir, 27(6), 3144 (2011)

[7] Choi YH, Hong SH, Langmuir, 31(29), 8101 (2015)

[8] Yabuki A, Arriffin N, Yanase M, Thin Solid Films, 519(19), 6530 (2011)

[9] Grouchko M, Kamyshny A, Magdassi S, Materials, 3, 4626 (2010)

[10] Azoubel S, Shemesh S, Magdassi S, Nanotechnology, 23, 344003 (2012)

[11] Magdassi S, Grouchko M, Berezin O, Kamyshny A, ACS Nano, 4, 1943 (2010)

[12] Huang K, Tsukamoto H, Yong Y, Chiu H, Nguyen MT, Yonezawa T, Liao Y, RSC Adv, 7, 25095 (2017)

[13] Lee B, Kim Y, Yang S, Jeong I, Moon J, Curr. Appl. Phys., 9(2), E157 (2009)

[14] Wunscher S, Abbel R, Perelaer J, Schubert US, J. Mater. Chem. C, 2, 10232 (2014)

[15] Gao Y, Zhang H, Jiu J, Nagao S, Sugahara T, Suganuma K, RSC Adv., 5, 1155 (2017)

[16] Farraj Y, Grouchko M, Magdassi S, Chem. Commun., 51, 1587 (2015)

[17] Galwey AK, Jamieson D, Brown ME, J. Phys. Chem., 78, 2664 (1974)

[18] Park S, Moon HC, Lee DH, RSC Adv., 6, 50158 (2016)

[19] Lee JH, Chung BH, Park SH, Moon HC, Lee DH, Macromol. Res., 26(2), 157 (2018)

[20] Huang S, Liu Y, Zhao Y, Ren Z, Guo CF, Adv. Funct. Mater., 29, 180592 (2019)

[21] Kim W, Lee S, Lee DH, Park IH, Bae JS, Lee TW, Kim JY, Park JH, Cho YC, Cho CR, Jeong S, Sci. Rep., 5, 10715 (2015)