To suppress wafer bowing and crack generation of GaN on Si substrates, we investigated the effects of the Al content and thickness of the AlGaN interlayer on the compressive strain in the overlying GaN layer theoretically and experimentally. In the simulation, AlGaN relaxes gradually over the critical thickness. Therefore, the relaxation ratio of AlGaN at the top surface can be defined as a function of Al content and thickness. Too high Al content or too thick AlGaN interlayer induced too large initial strain in the upper GaN layer, which caused rapid and succeeding gradual relaxation, i.e., decrease of strain, of the GaN layer during growth because of generation of threading dislocations. Conversely, low Al content or thin AlGaN interlayer could induce constant but only small strain in the GaN layer. Therefore, the ideal relaxation ratio of the AlGaN surface exists to apply the maximal constant compressive strain in the GaN layer. The relaxation ratios of AlGaN interlayers determined in experiments were much smaller than those calculated in the simulation. Although the measured compressive strain in the GaN layer was smaller than expected, its decrease rate was small when grown on AlGaN interlayers with an almost ideal relaxation ratio.