Pure Cu film strongly adherent to glass substrates was deposited by printing Cu(COOH)(2)-containing paste and decomposing it at 250 degrees C in nitrogen atmosphere. The complete transformation of Cu(COOH)(2) into Cu required 30 min and generated a low sheet resistance of 0.167 Omega/sq ( volume resistivity: 15.0 mu Omega.cm). Maximum adhesion between the Cu film and substrate was attained at the Cu complexes: a-terpineol mixing ratio of 6: 4 by weight. The spike-shaped microstructure at the Cu/glass interface was determined to be the main cause for the outstanding adhesion properties. The resistance further decreased to 0.084 Omega/sq by increasing the thickness and modifying the surface of the Cu film via electroless Cu plating.