A novel high-resolution nanoprinting method through self-driven electrodeposition is proposed and certain aspects are confirmed with known copper electrochemistry through multiphysics modeling. A series of simulations are conducted involving a nanopipette filled with concentrated CuSO4 solution introduced close to the working electrode (WE) in the cell of diluted CuSO4 electrolyte, where Cu2+ ions diffuse from nanopipette to the electrode and form a limited region with more concentrated cations compared to the rest of the cell. Meanwhile, this process leads to a more positive equilibrium potential of copper redox reaction and thereby local negative surface overpotential on WE. The negative surface overpotential drives the Cu2+ electrodeposition in the form of a nano-protrusion on the target location. (C) The Author(s) 2018. Published by ECS.