The influence of the silver nanoparticle (AgNP) concentration in solution on the electrodeposition of Zn-Cu/AgNP composite coatings was studied by cyclic voltammetry. The composition and structure of the Zn-Cu/AgNP composite coatings were analyzed using glow discharge spectroscopy (GDS), inductively coupled plasma spectrophotometry (ICP), and X-ray diffraction (XRD). The electrodeposition of Zn-Cu/AgNP composites was studied in an electrolytic bath containing glycine and AgNPs in suspension and was shown to occur through two processes with different energies. The first process (Pc-IV) occurs in the potential range from - 0.4 to -0.7 V vs saturated calomel electrode (SCE) and is mainly associated with the electrodeposition of a copper film, while the second process (Pc w ) corresponds to the bulk deposition of Zn-Cu/AgNPs and occurs from -1.4 to -1.6 V vs SCE. The formation of different phases of the Zn-Cu alloys and a change in the elemental composition of the coating as a function of the AgNP concentration in solution were observed from the elemental composition analysis. Antimicrobial tests performed on the Zn-Cu/AgNP composite coatings against the microorganisms Escherichia coli as a model gram-negative bacteria and Staphylococcus aureus as a model gram-positive bacteria revealed 95% to 100% inhibition of bacterial growth after 10 min of contact for the Zn-Cu/AgNP coating with a AgNP content of 0.28 wt%.