In this paper, a novel heat sink combining the manifold flow distributor, impinging nozzle-jet, and micro pin-fin concepts is proposed. The flow distribution structure of the heat sink is inspired by black and white fields of the chessboard. Every inlet nozzle is surrounded by four outlet nozzles and vice versa. A 3-dimensional numerical simulation model of the basic heat sink structure is introduced to investigate the thermal and hydrodynamic performances. Several configurations with different pin-fin and nozzle geometries and its sensitivity to the geometrical parameters are discussed for optimization. Designs with different numbers of pin-fins in the unit cell of heat sink are also compared. The results show that, for a 2 x 2 cm(2) chip or photovoltaic, a total thermal resistance of 9.37 x 10(-6) Km(2)/W is achieved at a flow rate of 1 L/min and a pressure drop of 4928 Pa. A maximum cooling capacity of 700 W/cm(2) can be satisfied with the temperature difference between the fluid inlet and chip of 65.5 K, and the temperature non uniformity of the heating surface of only 2.33 K. The numerical results indicate that the novel heat sink shows great advantages of both uniform flow distribution and ultra-high heat flux cooling. (C) 2018 Elsevier Ltd. All rights reserved.