We investigate the possibility to combine Zn(O,S) buffer layers grown by atomic layer deposition (ALD) with KF post-deposition treated Cu(In,Ga)Se-2 (CIGS-KF) in solar cells. It is shown that the beneficial effect on open-circuit voltage from the post-deposition treatment is essentially independent of buffer layer material. However, a wet chemical surface treatment is required prior to ALD in order to achieve competitive fill factor values. A water rinse is sufficient to create an absorber surface similar to the one formed during a conventional CdS chemical bath deposition process. However, it is observed that CIGS-KF/Zn(O,S) devices made with water-rinsed absorbers systematically result in lower fill factor values than for the corresponding CIGS-KF/CdS references. This effect can be mitigated by decreasing the H2S:H2O precursor ratio during ALD initiation, indicating that the fill factor limitation is linked to the initial Zn(O,S) growth on the modified CIGS-KF surface. The best CIGS-KF/Zn (O,S) devices were fabricated by etching away the KF-modified surface layer prior to ALD, followed by a low temperature anneal. The thermal treatment step is needed to increase the open-circuit voltage close to the value of the CdS devices. The results presented in this contribution indicate that the main beneficial effects from KFPDT in our devices are neither associated with the CdS CBD process nor due to the formation of a K-In-Serich phase on the CIGS surface.