Direct bonding of copper and porous LaCrO3 without an extra filler interlayer was successfully completed using local and fast Cu-infiltration through laser cladding. This significantly reduced the susceptibility of the ceramic to cracking. A high-speed camera investigation into the wetting and infiltration behavior of a Cu-melt into LaCrO3 with a porosity of 63vol% was performed. By adjusting the focal distance with a constant laser power of 300W, the Cu-melt was rapidly infiltrated into the ceramic preform in 10seconds. This was completed under atmospheric air conditions, without added inert gas. The joining process developed can be used to fabricate ceramic/metal joints with targeted (micro-) structure properties by adjusting the infiltrated melt and the infiltration depth, which would be suitable for many applications, such as multifunctional devices, solid oxide fuel cells or heating elements.