Two new phenylethynyl endcapping compounds, 3- and 4-amino-4’-phenylethynylbenzophenone, were synthesized and used to terminate imide oligomers from 3,4’-oxydianiline and 4,4’-oxydiphthalic anhydride at a calculated molecular weight of 9000 g/mol and from 3,4’-oxydianiline (0.85 mol), 1,3-bis( 3-aminophenoxy)benzene (0.15 mol), and 3,3’,4,4’-biphenyltetracarboxylic dianhydride at a calculated molecular weight of 5000 g/mol. Glass transition temperatures for the cured oligomers were similar to 249 degrees C for the former and similar to 272 degrees C for the latter. Films cured at 350 degrees C for 1 h were tough and flexible and provided high tensile properties. The uncured oligomers were readily compression molded to provide tough, solvent-resistant moldings.