화학공학소재연구정보센터
홈 로그인 로그아웃 연락처 사이트맵
Polymer(Korea), Vol.42, No.2, 230-241, March, 2018
DOI10.7317/pk.2018.42.2.230  Export Citation
Polyamide-6/Boron Nitride 열전도성 복합재료의 모폴로지 및 열적 특성과 결정화 거동
Morphology, Thermal and Crystallization Properties of Polyamide-6/Boron Nitride (BN) Thermal Conductive Composites
Ru Xia†, Manman Sun, Bin Yang†, Jiasheng Qian, Peng Chen, Ming Cao, Jibin Miao, and Lifen Su
  • College of Chemistry & Chemical Engineering, Key Laboratory of Environment-Friendly Polymeric Materials of Anhui Province, Anhui University, Hefei 230601, Anhui, P. R. China
E-mail:,
A series of the thermal conductive polyamide-6 (PA6) composites filled with boron nitride (BN) were prepared by two methods, including melting method (MM) and solution method (SM). The thermal conductivity, morphology, crystallization behavior, thermal stability, and rheological properties of PA6 composites were investigated. The results showed that the thermal conductivity of two methods increased with increase in the filler content, the thermal conductivity of PA6/BN composites containing 40 wt% BN prepared by melting method was up to 1.02W·m-1·K-1, while the thermal conductivity of PA6/BN composites prepared by solution method was up to 1.44 W·m-1·K-1 at the same filler content.
Keywords:polyamide-6;boron nitride;melting method;solution method;thermal conductivity
  1. Donald M, Bigg B, Polym. Eng. Sci., 17, 847 (1977)
  2. Vu MC, Park GD, Bae YH, Kim SR, Polym. Korea, 40(5), 804 (2016)
  3. Zhou WY, Qi SH, Zhao HZ, Liu NL, Polym. Compos., 28, 23 (2007)
  4. Li TL, Hsu SLC, J. Appl. Polym. Sci., 121(2), 916 (2011)
  5. Ha JU, Hong J, Kim M, Choi JK, Park DW, Shim SE, Polym. Korea, 37(6), 722 (2013)
  6. Gaxiola DL, Keith JM, King JA, Johnson BA, J. Appl. Polym. Sci., 114(5), 3261 (2009)
  7. Rafique FZ, Vasanthan N, J. Phys. Chem. B, 118(31), 9486 (2014)
  8. Heiser JA, King JA, Konell P, Sutter LL, Polym. Compos., 25, 407 (2004)
  9. Yoo Y, Lee HL, Ha SM, Jeon BK, Won JC, Lee SG, Polym. Int., 63, 151 (2014)
  10. Han Z, Fina A, Prog. Polym. Sci, 36, 914 (2011)
  11. Li ZG, Wu WJ, Chen H, Zhu ZH, Wang YS, Zhang Y, Rsc. Adv., 3, 6417 (2013)
  12. Hong J, Lee J, Hong CK, Shim SE, Curr. Appl. Phys., 10(1), 359 (2010)
  13. Yu SZ, Hing P, Hu X, Compos. Pt. A-Appl. Sci. Manuf., 33, 289 (2002)
  14. Agari Y, Ueda A, Nagai S, J. Appl. Polym. Sci., 42, 1665 (1991)
  15. Liu T, Li JL, Wang XZ, Deng ZH, Yu XJ, Lu A, Yu FM, He JP, J. Thermoplast. Compos. Mater., 28, 32 (2015)
  16. Mu QH, Feng SY, Thermochim. Acta, 462(1-2), 70 (2007)
  17. Manchado MAL, Herrero B, Arroyo M, Polym. Int., 53, 1766 (2004)
  18. Liu SP, Hwang SS, Yeh JM, Hung CC, Int. Commun. Heat Mass Transf., 38, 37 (2011)
  19. Yung KC, Liem H, J. Appl. Polym. Sci., 106(6), 3587 (2007)
  20. Sichel EK, Miller RE, Abrahams MS, Buiocchi CJ, Phys. Rev. B, 13, 4607 (1976)
  21. Golberg D, Bando Y, Huang Y, Terao T, Mitome M, Tang CC, Zhi CY, ACS Nano, 4, 2979 (2010)
  22. Zhi CY, Bando Y, Tang CC, Kuwahara H, Golberg D, Adv. Mater., 21(28), 2889 (2009)
  23. Coleman JN, Lotya M, O’Neill A, Bergin SD, King PJ, Khan U, Young K, Gaucher A, De S, Smith RJ, Shvets IV, Arora SK, Stanton G, et al., Science, 42, 568 (2011)
  24. Sato K, Horibe H, Shirai T, Hotta Y, Nakano H, Nagai H, Mitsuishi K, Watari K, J. Mater. Chem., 20, 2749 (2010)
  25. Terao T, Zhi CY, Bando Y, Mitome M, Tang CC, Golberg D, J. Phys. Chem. C, 114, 4340 (2010)
  26. Kuang ZQ, Chen YL, Lu YL, Liu L, Hu S, Wen SP, Mao YY, Zhang LQ, Small, 11, 1655 (2015)
  27. Hong JP, Yoon SW, Hwang T, Oh JS, Hong SC, Lee Y, Nam JD, Thermochim. Acta, 537, 70 (2012)
  28. Chae DW, Kim BC, Polym. Adv. Technol., 16, 846 (2005)
  29. Lee GW, Park M, Kim J, Lee JI, Yooh HG, Compos. Pt. A-Appl. Sci. Manuf., 37, 727 (2006)
  30. Araby S, Meng QS, Zhang LQ, Kang HL, Majewski P, Tang YH, Ma J, Polymer, 55(1), 201 (2014)
  31. Li SS, Qi SH, Liu NL, Cao P, Thermochim. Acta, 523(1-2), 111 (2011)
  32. Potts JR, Shankar Q, Murali S, Du L, Ruoff RS, Compos. Sci. Technol., 74, 166 (2013)
  33. Liu TX, Tjiu WC, He C, Na SS, Chung TS, Polym. Int., 53, 392 (2004)
  34. Sanli S, Durmus A, Ercan N, J. Appl. Polym. Sci., 125, E268 (2012)
  35. Lincoln DM, Vaia RA, Wang ZG, Hsiao BS, Polymer, 42(4), 1621 (2001)
  36. Sreekanth MS, Panwar AS, Po¨tschke P, BhattacharyyaA AR, Phys. Chem. Chem. Phys., 17, 9410 (2015)
  37. Augustine JM, Maiti SN, Gupta AK, J. Appl. Polym. Sci., 125, E478 (2012)
  38. Sanh S, Durmus A, Ercan N, J. Mater. Sci., 47(7), 3052 (2012)
  39. Wu BZ, Gong Y, Yang GS, J. Mater. Sci., 46(15), 5184 (2011)
  40. Phang IY, Ma JH, Shen L, Liu TX, Zhang WD, Polym. Int., 55, 71 (2006)
  41. Fornes TD, Paul DR, Polymer, 44(14), 3945 (2003)
  42. Liang JC, Xu YQ, Wei ZY, Song P, Chen GY, Zhang WX, J. Therm. Anal. Calorim., 115, 209 (2014)
  43. Zhang PP, Zhu KY, Su LQ, Ru X, Adv. Mater. Res., 621, 31 (2013)
  44. Ibrahim S, Johan MR, Int. J. Electrochem. Sci., 7, 2596 (2012)
  45. Wang ZF, Qi R, Wang J, Qi SH, Ceram. Int., 41, 13541 (2015)
  46. Oh JS, Lee JM, Ahn WS, Polym. Korea, 33(5), 435 (2009)
  47. Holmes DR, Bunn CW, Smith DJ, J. Polym. Sci., 17, 159 (1955)
  48. Kasgoz A, Akin D, Durmus A, Polym. Eng. Sci., 52(12), 2645 (2012)
  49. Jiang G, Huang HX, Chen ZK, Polym. -Plast. Technol. Eng., 50, 1035 (2011)
  50. Song JP, Kim JY, Lee SJ, Polym. Korea, 41, 722 (2017)
  51. Kim H, Macosko CW, Polymer, 50(15), 3797 (2009)