Samples of electrolytic tough pitch copper were deformed in equal channel angular pressing with enhanced productivity to quickly refine its initial coarse-grained microstructure at room temperature. The evolution in microstructure and changes in a broad range of properties were compared to a sample in the undeformed state. The microstructure evolution was evaluated using electron backscatter diffraction for both states and transmission electron microscopy for a detailed microstructure characterization of the deformed sample. The microstructure observations were correlated with the results of tensile tests, electrochemical tests in 3.5 wt% NaCl, electrical conductivity measurements and thermal stability up to 200 A degrees C. The ECAP process employed in this study caused a grain refinement from about 16 A mu m to about 600 nm. The microstructure refinement caused a 50% increase in both the YS and UTS. The elongation to failure, due to the high amount of LAGBs, maintained a high value of 13.3%. The corrosion and pitting potentials were higher for the deformed sample. Furthermore, the grain refinement caused a decrease in electrical conductivity from 100.2% IACS to 93.1% IACS, a drop of 7% IACS. The deformed sample displayed thermal stability up to a temperature of 175 A degrees C, where there was a drop in micro-hardness of more than 10%.