- Previous Article
- Next Article
- Table of Contents
Korean Journal of Materials Research, Vol.27, No.8, 397-402, August, 2017
무전해 Ni 도금을 위한 양극 산화막위에 스크린 인쇄된 Ag 페이스트 패턴의 정밀도 개선
Accuracy Improvement of Screen Printed Ag Paste Patterns on Anodized Al for Electroless Ni Plating
E-mail:
We used an etching process to control the line-width of screen printed Ag paste patterns. Ag paste was printed on anodized Al substrate to produce a high power LED. In general, Ag paste spreads or diffuses on anodized Al substrate in the process of screen printing; therefore, the line-width of the printed Ag paste pattern increases in contrast with the ideal line-width of the pattern. Smudges of Ag paste on anodized Al substrate were removed by neutral etching process without surface damage of the anodized Al substrate. Accordingly, the line-width of the printed Ag paste pattern was controlled as close as possible to the ideal line-width. When the etched Ag paste pattern was used as a seed layer for electroless Ni plating, the line width of the plated Ni film was similar to the line-width of the etched Ag paste pattern. Finally, in pattern formation by Ag paste screen printing, we found that the accuracy of the line-width of the pattern can be effectively improved by using an etching process before electroless Ni plating.
- Rha SK, Kim HC, Lee YS, J. Nanosci. Nanotechnol., 14, 8615 (2014)
- Rha SK, Cho YR, Yoon JS, Lee YS, J. Nanosci. Nanotechnol., 13, 6307 (2013)
- Rha SK, Lee YS, J. Nanosci. Nanotechnol., 15, 2422 (2015)
- Kim KM, Shin SH, Lee YK, Choi SM, Kwon YS, Electron. Lett., 44, 24 (2008)
- Liu S, Luo X, LED Packaging for Lighting Applications; Design, Manufactureing and Testing (Chemical Industry Press, Singapore) p. 160 (2011).
- Lee J, Kim Y, Jung U, Chung W, Mater. Chem. Phys., 141(2-3), 680 (2013)
- Inns D, Energy Procedia, 98, 23 (2016)
- Somalu MR, Muchtar A, Ramli W, Daud W, Brandon NP, Renew. Sust. Energ. Rev., 75, 426 (2017)
- Khanna A, Basu PK, Filipovic A, Shanmugam V, Schmiga C, Aberle AG, Mueller T, Sol. Energy Mater. Sol. Cells, 132, 589 (2015)
- Park BG, Jung KH, Jung SB, J. Alloy. Compd., 699, 1186 (2017)
- Bouyelfane A, Zerga A, Mater. Sci. Semicond. Process, 26, 312 (2014)
- Chu Z, Peng J, Jin W, Sens. Actuators B-Chem., 243, 919 (2017)
- Mannl U, Berg CVD, Magunje B, Harting B, Britton DT, Jones S, Staden MJV, Scriba MR, Nanotechnology, 25, 094004 (2014)
- Faddoul R, Bruas NR, Blayo A, Mater. Sci. Eng. B-Solid State Mater. Adv. Technol., 177, 1053 (2012)
- Park K, Seo D, Lee J, Colloids Surf. A: Physicochem. Eng. Asp., 313-314, 351 (2008)
- Park SG, Lee YS, Rha SK, J. Korean Phys. Soc., 69, 164 (2016)