AgCuO2 nanoplates have been electrodeposited onto indium-tin oxide (ITO) coated glass near room temperature in an alkaline aqueous solution contained silver(I)/copper(II) ammonia complexes. The Ag(I)/Cu(II) ammonia complexes act as water or ammonia oxidation catalysts to generate acid and lower the local pH at ITO electrode, and then Ag+ and Cu2+ ions are partial oxidized and dissociated from complexes to react with OH-to form AgCuO2 deposits on ITO. The electrodeposited AgCuO2 are composed of single crystal cuboidal nanoplates with a preferential orientation along [-202] crystal axis. X-ray photoelectron spectra results indicate that the Ag and Cu ions in AgCuO2 are partially oxidized to +3 valence states. The as-electrodeposited AgCuO2 nanoplates show four distinct discharge processes at + 0.28, + 0.01, -0.42, and -0.67 V vs. Ag/AgCl. (C) 2017 The Electrochemical Society. All rights reserved.