Oxidation behavior of integrated interconnect with bipolar plate and corrugated sheet made by ferrite steel SUS430 is investigated and compared in simulated environment and in a realistic stack. Electrical current is found to have a direction-related impact on the thickness of the Cr2O3/MnCr2O4 composite oxide scale. Oxide scale of the interconnect aged in the stack exhibits a dual-layered structure of a complex Mn-Cr oxide layer covered by iron oxide. The oxidation rates vary greatly depending on its local environment, with different thermal, electrical density, as well as gas composition conditions. By analyzing the thickness distribution of oxide scale and comparing them with the simulated test result, the oxidation behavior of interconnect in stack is described in high definition. ASR distribution is also conducted by calculation, which could help further understanding the behavior of stack degradation. (C) 2017 Elsevier B.V. All rights reserved.