The major barrier for PV penetration is cost. And the single most important cost factor in silicon technology is the wafer (approximate to 35% of the module cost). Although tremendous progress on cell processing has been reported in recent years, a much smaller evolution is seen on what should be the key point to address - the wafer. The ingotslicing process is reaching its limits as the wafer thickness is reduced in an effort to lower material costs. Kerf losses of approximate to 50% and an increase in breakage of a high value added material are putting a lower bound to this approach. New ideas are therefore needed for producing wafers in a way to overcome these limitations. In this paper we present three new concepts being developed in our laboratory that have one thing in common: they all are zero kerf loss processes, aiming at significant reductions in material loss. One explores the concept of exfoliation, the other two aim at the growth of silicon directly into ribbons. These were conceived as continuous processes, based on a floating molten zone concept, to avoid impurity contamination during crystallization.