Water Repellency of Large-Scale Imprinting-Assisted Polymer Films

Harim Choi; Seulyi Lee; Sang Hee Park; Joong Se Ko; Hoichang Yang

Macromolecular Research, Vol.25, No.6, 584-590, June, 2017

DOI10.1007/s13233-017-5103-z Export Citation

Water Repellency of Large-Scale Imprinting-Assisted Polymer Films

Harim Choi, Seulyi Lee, Sang Hee Park¹, Joong Se Ko, and Hoichang Yang^†

Department of Applied Organic Materials Engineering, Inha University, Incheon 22212, Korea
¹Department of Chemical and Biological Engineering, Korea University, Seoul 02841, Korea

E-mail:

We report that the water repellency of polymeric film surfaces can be simply tuned by pressing softened polymer films into porous anodized aluminum oxide (AAO) templates. Highly-dense nano-pillars and nano-hairs on the polymer surfaces are reproduced via physically or chemically separating the AAO templates from the impressed polymer films. The resulting polymeric nano-textures show various aspect ratios (ARs) between height and cross-sectional diameter (from 2 to 130), depending on the viscoelastic response of the polymer chains during hot AAO pressing and the subsequent separation procedures. The water contact angle values on the nano-textured polymer films considerably changed from 91° to 160° with an increase in AR. Using hot pressing and physical detachment of a porous AAO-covered Al cylinder roller, we successfully demonstrated the potential for large-area fabrication of superhydrophobic polymer films with characteristics that are similar to lotus leaves.

Keywords:superhydrophobicity;texturing;wettability;contact angle;aluminum oxide (AAO)

[References]

Feng L, Li SH, Li YS, Li HJ, Zhang LJ, Zhai J, Song YL, Liu BQ, Jiang L, Zhu DB, Adv. Mater., 14(24), 1857 (2002)
Feng L, Zhang YA, Xi JM, Zhu Y, Wang N, Xia F, Jiang L, Langmuir, 24(8), 4114 (2008)
Li XM, Reinhoudt D, Crego-Calama M, Chem. Soc. Rev., 36, 1350 (2007)
Roach P, Shirtcliffe NJ, Newton MI, Soft Matter, 4, 224 (2008)
Lee YW, Park SH, Kim KB, Lee JK, Adv. Mater., 19(17), 2330 (2007)
Bell MS, Shahraz A, Fichthorn KA, Borhan A, Langmuir, 31(24), 6752 (2015)
Bhushan B, Jung YC, J. Phys. Condens. Matter, 20, 225010 (2008)
Huovinen E, Hirvi J, Suvanto M, Pakkanen TA, Langmuir, 28(41), 14747 (2012)
Wenzel RN, Ind. Eng. Chem., 28, 988 (1936)
Cassie ABD, Baxter S, T. Faraday Soc., 40, 546 (1944)
Patankar NA, Langmuir, 20(19), 8209 (2004)
Gao LC, McCarthy TJ, Langmuir, 22(7), 2966 (2006)
Marmur A, Langmuir, 20(9), 3517 (2004)
Murakami D, Jinnai H, Takahara A, Langmuir, 30(8), 2061 (2014)
Ganesh VA, Raut HK, Nair AS, J. Mater. Chem., 21, 16304 (2011)
Yan YY, Gao N, Barthlott W, Adv. Colloid Interface Sci., 169, 80 (2011)
Celia E, Darmanin T, de Givenchy ET, Amigoni S, Guittard F, J. Colloid Interface Sci., 402, 1 (2013)
Lee W, Jin MK, Yoo WC, Lee JK, Langmuir, 20(18), 7665 (2004)
Lee DY, Lee DH, Lee SG, Cho K, Soft Matter, 8, 4905 (2012)
Lim CH, Han SY, Eo JD, Kim K, Kim WB, J. Mech. Sci. Technol., 29, 5107 (2015)
Masuda H, Yada K, Osaka A, Jpn. J. Appl. Phys., 37, L1340 (1998)
Chu SZ, Wada K, Inoue S, Isogai M, Katsuta Y, Yasumori A, J. Electrochem. Soc., 153(9), B384 (2006)
Lee W, Park SJ, Chem. Rev., 114(15), 7487 (2014)
Choi K, Park SH, Song YM, Lee YT, Hwangbo CK, Yang H, Lee HS, Adv. Mater., 22(33), 3713 (2010)
Cho WK, Choi IS, Adv. Funct. Mater., 18(7), 1089 (2008)
Schubert B, Majidi C, Groff RE, Baek S, Bush B, Maboudian R, Fearing RS, J. Adhes. Sci. Technol., 21, 1298 (2007)
Chaudhury MK, Mater. Sci. Eng. R., 16, 97 (1996)
Wu JJ, Buckley CP, J. Polym. Sci. B: Polym. Phys., 42(11), 2027 (2004)
Keddie JL, Jones RAL, Cory RA, Europhys. Lett., 27, 59 (1994)
Kuznetsov YG, McPherson A, Microbiol. Mol. Biol. R., 75, 268 (2011)

[1] Feng L, Li SH, Li YS, Li HJ, Zhang LJ, Zhai J, Song YL, Liu BQ, Jiang L, Zhu DB, Adv. Mater., 14(24), 1857 (2002)

[2] Feng L, Zhang YA, Xi JM, Zhu Y, Wang N, Xia F, Jiang L, Langmuir, 24(8), 4114 (2008)

[3] Li XM, Reinhoudt D, Crego-Calama M, Chem. Soc. Rev., 36, 1350 (2007)

[4] Roach P, Shirtcliffe NJ, Newton MI, Soft Matter, 4, 224 (2008)

[5] Lee YW, Park SH, Kim KB, Lee JK, Adv. Mater., 19(17), 2330 (2007)

[6] Bell MS, Shahraz A, Fichthorn KA, Borhan A, Langmuir, 31(24), 6752 (2015)

[7] Bhushan B, Jung YC, J. Phys. Condens. Matter, 20, 225010 (2008)

[8] Huovinen E, Hirvi J, Suvanto M, Pakkanen TA, Langmuir, 28(41), 14747 (2012)

[9] Wenzel RN, Ind. Eng. Chem., 28, 988 (1936)

[10] Cassie ABD, Baxter S, T. Faraday Soc., 40, 546 (1944)

[11] Patankar NA, Langmuir, 20(19), 8209 (2004)

[12] Gao LC, McCarthy TJ, Langmuir, 22(7), 2966 (2006)

[13] Marmur A, Langmuir, 20(9), 3517 (2004)

[14] Murakami D, Jinnai H, Takahara A, Langmuir, 30(8), 2061 (2014)

[15] Ganesh VA, Raut HK, Nair AS, J. Mater. Chem., 21, 16304 (2011)

[16] Yan YY, Gao N, Barthlott W, Adv. Colloid Interface Sci., 169, 80 (2011)

[17] Celia E, Darmanin T, de Givenchy ET, Amigoni S, Guittard F, J. Colloid Interface Sci., 402, 1 (2013)

[18] Lee W, Jin MK, Yoo WC, Lee JK, Langmuir, 20(18), 7665 (2004)

[19] Lee DY, Lee DH, Lee SG, Cho K, Soft Matter, 8, 4905 (2012)

[20] Lim CH, Han SY, Eo JD, Kim K, Kim WB, J. Mech. Sci. Technol., 29, 5107 (2015)

[21] Masuda H, Yada K, Osaka A, Jpn. J. Appl. Phys., 37, L1340 (1998)

[22] Chu SZ, Wada K, Inoue S, Isogai M, Katsuta Y, Yasumori A, J. Electrochem. Soc., 153(9), B384 (2006)

[23] Lee W, Park SJ, Chem. Rev., 114(15), 7487 (2014)

[24] Choi K, Park SH, Song YM, Lee YT, Hwangbo CK, Yang H, Lee HS, Adv. Mater., 22(33), 3713 (2010)

[25] Cho WK, Choi IS, Adv. Funct. Mater., 18(7), 1089 (2008)

[26] Schubert B, Majidi C, Groff RE, Baek S, Bush B, Maboudian R, Fearing RS, J. Adhes. Sci. Technol., 21, 1298 (2007)

[27] Chaudhury MK, Mater. Sci. Eng. R., 16, 97 (1996)

[28] Wu JJ, Buckley CP, J. Polym. Sci. B: Polym. Phys., 42(11), 2027 (2004)

[29] Keddie JL, Jones RAL, Cory RA, Europhys. Lett., 27, 59 (1994)

[30] Kuznetsov YG, McPherson A, Microbiol. Mol. Biol. R., 75, 268 (2011)