Micro-scale columnar architectures composed of copper sheets with nanometer thickness were fabricated by electrodeposition using a photolithography technique. A copper sulfate solution containing a polyacrylic acid was used as the plating bath, and the electrodeposition was conducted under galvanostatic conditions. Patterned electrodeposits with a cylindrical shape and composed of thin copper sheets were formed. Every copper deposit had openings on the top and side regions and also had a porous interior. This novel three-dimensional (3D) copper architecture should provide functional copper electrodes with large effective surface areas. (C) The Author(s) 2016. Published by ECS. All rights reserved.