Journal of Polymer Science Part A: Polymer Chemistry, Vol.54, No.24, 3835-3845, 2016
Preparation and thermal stability of fluoroalkyl end-capped vinyltrimethoxysilane oligomeric silica/boric acid nanocomposites-encapsulated a variety of low molecular weight organic compounds
Fluoroalkyl end-capped vinyltrimethoxysilane oligomer [R-F-(VM)(n)-R-F] reacted with boric acid to afford the corresponding fluorinated oligomeric silica/boric acid nanocomposite [R-F-(VMSiO2)(n)-R-F/B(OH)(3)] fine particles with mean diameter: 36-105nm. The obtained R-F-(VMSiO2)(n)-R-F/B(OH)(3) nanocomposites were applied to the encapsulation of low molecular weight organic compounds such as diphenylsilanediol, 1,1-bi-2-naphthol, 4,4-biphenol, bisphenol A, bisphenol F, bisphenol AF, biphenyl, dibenzyl, and pentaerythritol into these nanocomposite cores to provide the corresponding fluorinated oligomeric silica/boric acid nanocompositesencapsulated these organic molecules. Interestingly, the obtained nanocomposites were found to exhibit no weight loss behavior corresponding to the contents of these guest molecules even after calcination at 800 degrees C, although these nanocomposites were isolated through no purification process. The R-F-(VMSiO2)(n)-R-F nanocompositesencapsulated these organic guest molecules were prepared under similar conditions. However, it was demonstrated that these nanocomposites can provide the clear weight loss corresponding to the contents of these guest molecules in the nanocomposites after calcination at 800 degrees C. (c) 2016 Wiley Periodicals, Inc. J. Polym. Sci., Part A: Polym. Chem. 2016, 54, 3835-3845
Keywords:encapsulation;fluorinated oligomer;fluorinated silica;boric acid nanocomposite particle;low molecular organic compounds;thermal stability