For the purpose of the platinization of titanium, grinding, ething, and platinizing methods of titanium have been investigated in this study. The uniform finest etching structure was obtained in iodine solution at low concentration. From the platinization at low current density of 0.57A/dm(2), the stable platinized layer over 10 μm could be obtainable. The highest current efficiency of the platinization process was shown to be up to 67 %.