Journal of Electroanalytical Chemistry, Vol.621, No.2, 229-237, 2008
Combining electrochemical desorption and metal deposition on patterned self-assembled monolayers
We have combined electrochemical reductive desorption with microdisplacement printing to create patterned self-risen in bled monolayers inaccessible by other methods. The resulting structures were characterized with field emission scanning electron microscopy, scanning tunneling microscopy. atomic force microscopy, and cyclic voltammetry. Additionally, we have demonstrated that the chemical patterns produced by microdisplacement printing on Au{1 1 1} can function as resists for patterned metallic films where 1-adamantanethiolate regions can be selectively desorbed, followed by metal deposition into regions of exposed gold substrates or metal films can be deposited directly through the 1-adamantanethiolate regions, because the 1-adamantanethiolate monolayers allow electron transfer from the supporting electrolyte to the electrode surface (like all unfunctionalized electrode). This is in contrast to typical alkanethiolate monolayers oil Au{1 1 1}, which block the same electrochemical process. These selective electrochemical desorption and deposition processes call be coupled to hybrid soft-lithography strategies to enable fabrication of novel hybrid metallic and organic structures. (c) 2007 Elsevier B.V. All rights reserved.
Keywords:Self-assembled monolayers;Microdisplacement printing;Electrochemical desorption;Electrochemical deposition;Self- and directed-assembly;Soft-lithography