화학공학소재연구정보센터
Molecular Crystals and Liquid Crystals, Vol.464, 769-776, 2007
Formation of circuit pattern on liquid-crystalline polymer film by electroless copper plating
Liquid- crystalline polymer ( LCP) films were treated with N-2 plasma in order to improve adhesion with metal film. By N-2 plasma treatment, hydrophilic groups such as NH, COOH and OH were introduced into LCP film and the surface of the film was roughened slightly. After N-2 plasma treatment, a copper film was deposited on the LCP by electroless plating method. The circuit pattern of copper film with 0.5mm ( line) and 0.3mm ( space) intervals was fabricated on the LCP film.