As EMC of semi-conductor encapsulants contains high concentrations of filler, its flow behaviors are greatly affected by the concentrations and properties of those fillers during the chip-encapsultaion process. This paper reports the effects of a fillers by compared with the computer simulation and short experimental results conducted at various process conditions. The simulation results was in good agreement with short shot results with respect to the fill time, but melt-front was not matched thoroughly.