Copper nanowire particles were synthesized by reducing Cu(NO3)(2) with hydrazine, and copper nanowire/epoxy composites were prepared for use as thermal interface materials. The surfaces of the copper nanowire particles were coated with TiO2 to enhance the mechanical and thermal properties in the polymer matrix. The TiO2-coated copper nanowire/epoxy composites exhibited thermal conductivities ranging from 0.2 to 1.1248 W/m K, values that are higher than those of raw copper nanowire/epoxy composites at the same weight fraction. The effects of the TiO2-coated copper nanowire were investigated through various thermal conductivity prediction models. In addition, the TiO2-coated copper nanowire composites showed decreased electrical conductivity as compared with raw copper nanowire composites. Thus, the TiO2-coated copper nanowire composites prepared in the present work could prove to be desirable as thermal interface materials in the electronics industry. (C) 2015 Elsevier Ltd. All rights reserved.