The TSV filling using the dialyl-amine and the Br and Cl halogen ions to a copper electrodeposition bath is reported. The TSV bottom acceleration and TSV outside inhibition have been measured by an electrochemical method using the rotating disk electrode and numerical computation of the fluid dynamics. A perfect TSV filling is achieved with 1 ppm P(DAMA[HBr]/SO2) + 1 ppm of Br- and the electrodeposited morphology is fine and bright. This shows acceleration at the lower rotation speeds of the rotating disk electrode and an inhibition at the higher speeds, if compared to 1 ppm P(DAMA[HCl]/SO2) + Cl- 1 ppm. Br- 1 ppm shows a stronger inhibition at the higher rotation speeds, if compared to Cl- 1 ppm. The addition of SPS in addition to Br- 1 ppm shows acceleration at the lower speeds. No voids formed at the higher current density of 3.5 mA/cm(2) with SPS. (C) The Author(s) 2015. Published by ECS.