The electoless plating has recently attracted considerable attention from those concerned with the fabrication of electronic devices because electroplating is not applicable to satisfy that circuits are becoming finer and dense. A bondability also is discussed on the one of the characteristic of electroless Ni/Au plating and it''s contact material for the improving their high quality instruments was tried to developed in this wrok. So fianally, the bondability of the electroless Ni/Au finish were measured successfully by gold wire full-test (wire diameter=1.2mil) and the bonding force could build up maxium about 7 g.