The effect of gelatine addition to the electrodeposition bath on the tin content of the solder deposits was investigated. The results showed that as little as 0.5 gl(-1) gelatine greatly enhanced the tin content of the deposits. The maximum tin content achievable for the deposit was approximately equal to the percentage of tin in the deposition bath. A lower current density and a greater metal content of the deposition bath tended to offset the effect of gelatine in promoting tin content of the deposit. Gelatine was found, with the aid of scanning electron microscopy and X-ray diffractometry, strongly to affect the morphology and facet orientation of the deposits.