In this study, a Ni/Ag/Ni/Au multilayer with first Ni layer of 0.5 nm was first optimized for high reflectivity (92.3%), low specific contact resistance (2.1 x 10(-3) Omega cm(2)) and good attachment strength to p-type GaN. To further decrease the contact resistance, the p-type GaN surface was previously treated with pre-annealed indium-tin-oxide (ITO) film before deposition of the Ni/Ag/Ni/Au multilayer, and resulted in a lower specific contact resistance of 1.9 x 10(-4) Omega cm(2). The X-ray photoelectron spectroscopy results indicated that Ga 2p core level of the p-type GaN surface with the pre-annealed ITO film had a lower binding energy, leading to a reduction in the contact resistance. Furthermore, GaN-based flip-chip light-emitting diodes (LEDs) with and without the pre-annealed ITO film were fabricated. The average forward voltage of the flip-chip LEDs fabricated with the pre-annealed ITO film is 3.22V at an injection current density of 35 A/cm(2), which is much lower than that (3.49 V) of flip-chip LEDs without the pre-annealed ITO film. These results reveal that the proposed approach is effectively to fabricate high quality p-type contacts toward high power GaN-based LEDs. (C) 2015 Published by Elsevier B.V.