Low dielectric constant (low-k) materials are used as inter-level insulators between copper (Cu) conductors to improve the characteristics of integrated circuits. This work proposes a new method for improving the characteristics of porous low-k dielectric film by capping it with an HfO2 film by atomic layer deposition (ALD). Experimental results revealed that capping a porous low-k dielectric film with a similar to 1.0 nm-thick HfO2 film increases its dielectric constant from 2.56 to 2.65 because the pores in the surface of the film are sealed by Hf precursors. The leakage current density and reliability of the porous low-k dielectrics are greatly improved. The HfO2 capping film also increased resistances against Cu diffusion and damage by oxygen plasma. Therefore, this ALD-deposited HfO2 capping film can be used as a pore-sealing layer and a Cu barrier layer for the porous low-k dielectric film in the future advanced technologies. (C) 2015 Elsevier B.V. All rights reserved.