폴리실라잔 가교제를 이용한 LED 에폭시 봉지재의 경화와 열 안정성 연구

박용해; 김진권; Longhai Piao; Jin Kwon Kim

Polymer(Korea), Vol.39, No.5, 733-738, September, 2015

DOI10.7317/pk.2015.39.5.733 Export Citation

폴리실라잔 가교제를 이용한 LED 에폭시 봉지재의 경화와 열 안정성 연구

Curing and Heat Stability of Epoxy Encapsulants with Polysilazane Cross-linking Agent

박용해, 김진권^†

국립공주대학교 화학과

Longhai Piao, and Jin Kwon Kim^†

Department of Chemistry, Kongju National University, 182 Shinkwan-dong, Kongju, Chungnam 314-701, Korea

E-mail:

초록

본 연구에서는 에폭시 그룹과 가교반응하는 폴리실라잔 가교제를 이용하여 LED용 비스페놀 A 에폭시 봉지 재와 실리콘-에폭시 봉지재를 경화시키고 열 안정성을 연구하였다. 비스페놀 A 에폭시 봉지재는 열 안정성이 높은 실리콘 기반의 반응성 폴리실라잔 가교제를 사용함으로써 기존의 저분자 유기 가교제를 사용할 때에 비해 월등히 높은 열 안정성을 보였고, 실리콘-에폭시 봉지재는 실리콘 함량의 저하 없이 경화시킴으로써 높은 열 안정성을 유지하는데 도움이 되었다. 또한 실리콘 봉지재의 굴절률이 낮은 단점을 보완하기 위해 굴절률이 높은 TiO2 나노입자와 실리콘-에폭시, 폴리실라잔 복합체를 형성하여 입자함량이 굴절률에 미치는 영향을 연구하였다.

Bisphenol A epoxy and silicone-epoxy LED encapsulants were cured by using polysilazane cross-linking agents, which could be used to initiate the ring-opening polymerization of epoxy group, and the heat stabilities of the encapsulants were examined. Bisphenol A epoxy encapsulants cured by polysilazane showed better heat stability than that with conventional organic cross-linking agents due to the superior heat stability of silicon-based polysilazane cross-linking agent. Silicone-epoxy encapsulants also presented excellent heat stability owing to the high silicon content of polysilazane cross-linking agent. In order to increase the refractive index of the silicone-epoxy encapsulants, TiO2 nanoparticles were dispersed in the silicone-epoxy and cured by polysilazane. The relationship between the refractive index and the TiO2 content was investigated.

Keywords:polysilazane;encapsulation;light-emitting diode;epoxy resin

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[1] Choi J, Kim SG, Laine RM, Macromolecules, 37(1), 99 (2004)

[2] Muth S, Schuurmans FJP, Pashley MD, IEEE J. Sel. Top. Quantum Electron., 8, 333 (2002)

[3] Bourget L, Corriu RJP, Lecercq D, Mutin PH, Vioux A, J. Non-Cryst. Solids, 242, 81 (1998)

[4] Katayama S, Yamada N, Shibata Y, Nosa K, J. Cer. Soc. Jpn., 111, 391 (2003)

[5] Schubert EF, Light Emitting Diodes, Cambridge University Press, UK, Cambridge, 2003.

[6] Mont FW, Kim JK, Schubert MF, Schubert EF, Siege RW, J. Appl. Phys., 103, 083120 (2008)

[7] Ho TH, Wang CS, Eur. Polym. J., 37, 267 (2001)

[8] Rubinsztajn MI, Rubinsztajn S, U. S. Patent 6,916,889 (2005).

[9] Gorczyca TB, U. S. Patent 6,800,373 (2004).

[10] Huang W, Yuan Y, Yu Y, J. Adhes. Inter., 7, 39 (2006)

[11] Peuckert M, Vaahs T, Bruck M, Adv. Mater., 2, 398 (1990)

[12] Crivello JV, Lee JL, J. Polym. Sci. A: Polym. Chem., 28, 479 (1990)

[13] Kubo T, Tataoka E, Kozuka H, J. Mater. Res., 19, 635 (2004)

[14] Lijima M, Kobayakawa M, Kamiya H, J. Colloid Interface Sci., 337(1), 61 (2009)

[15] Song YY, Hildebrand H, Schmuki P, Surf. Sci., 604, 346 (2010)

[16] Sabzi M, Mirabedini SM, Zohuriaan MJ, Atai M, Prog. Org. Coat., 65, 222 (2009)