Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages

Taewon Yoo; Kwangin Kim; Patrick Han; Wonbong Jang; Haksoo Han

Macromolecular Research, Vol.23, No.8, 776-786, August, 2015

DOI10.1007/s13233-015-3104-3 Export Citation

Norbornene end-capped polyimide for low CTE and low residual stress with changes in the diamine linkages

Taewon Yoo, Kwangin Kim, Patrick Han¹, Wonbong Jang², and Haksoo Han^†

Department of Chemical and Biomolecular Engineering, Yonsei University, 262 Seongsanno, Seodaemun-gu, Seoul, 120-749, Korea
¹Department of Chemical Engineering, School of Engineering and Applied Science, Yale University, New Haven, Connecticut, 06511, USA
²Department of R&D, LG Display, Gyeonggi, 413-811, Korea

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The effects of norbornene (NE) crosslinking and diamine bridge linkages (ether, sulfone, and trifluoromethyl) on polyimide films were investigated. The purpose of this study was to study the behavior of the NE endcapped polyimide with different diamine bridge linkage structure at elevated temperatures on residual stress and modulus change. 5-Norbornene-2,3-dicarboxylic acid was introduced as the end-capping agent in order to increase the ratio of crosslinking in the structure through reverse Diels-Alder reaction. Wide angle X-ray diffraction (WAXD) was measured to study the relation of d-spacing and structure change of the bridge linkage of polymers through NE crosslinking. Coefficient of thermal expansion (CTE) and residual stress were measured to confirm the loaded stress between the substrate and polymer film through a thin film stress analyzer (TFSA). Storage (ε′) and loss modulus (ε″) were studied at elevated temperatures to study the relation of bridge linkage mobility of the polyimide at elevated temperature.

Keywords:polyimide;norbornene;modulus;low coefficient of thermal expansion (CTE);residual stress;thermal property;d-spacing

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