고상공정에 의해 제조된 AIN-Cu 나노복합재료의 조직 특성과 열팽창계수 측정에 관한 연구

이광민; 이지성; 이승익; 김지순; T. Weissgaerber; B. Kieback; Kwang-Min Lee; Ji-Sung Lee; Seung-Ick Lee; Ji-Soon Kim; T. Weissgaerber; B. Kieback

Korean Journal of Materials Research, Vol.11, No.10, 863-868, October, 2001

Microstructural Characteristics and Thermal Expansion Coefficient of AlN-Cu Nanocomposite Materials Prepared by Solid State Processing

이광민^†, 이지성, 이승익¹, 김지순², T. Weissgaerber³, B. Kieback³

전남대학교 공과대학 신소재공학부
¹한양대학교 공과대학 재료공학부
²울산대학교 재료금속공학부
³Fraunhofer Institute for Applied Materials Research

Kwang-Min Lee^†, Ji-Sung Lee, Seung-Ick Lee¹, Ji-Soon Kim², T. Weissgaerber³, and B. Kieback³

Materials Science and Engineering Dept., Chonnam National University, Kwangju 500-757, Korea
¹Department of Materials Engineering, Hanyang University, Seoul 133-791, Korea
²Schcool of Materials Science and Engineering, University of Ulsan, Ulsan 680-749, Korea
³Dept. for Powder Metallurgy and Composite Materials, Fraunhofer Institute for Applied Materials Research, Dresden 01277, Germany

E-mail:

The present study was carried out to investigate the effect of MA processing variables on the microstructural properties of composite powders and the coefficient of thermal expansion of pulse electric current sintered AlN-Cu powder compacts. The AlN-Cu powders had a size of less than 15 μm with 25 nm size of copper crystallite after MA 32 hours. The finely distributed AlN-Cu powder compacts were completely achieved after PECS. The residual oxygen was considerably removed after hydrogen reduction treatment. The residual carbon was completely removed to 97%. The CTE of AlN-Cu powder compacts showed a good consistency with Kingery-Tuner model when the volume fraction of copper was less than 60%. When it was more than 60%, the CTE had a good agreement with Series model.

Keywords:Mechanical Alloying;Powder Processing;Composites;Thermal Expansion

[References]

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[1] Kim JI, Bulletin of the Kor. Inst. Met. Mat, 10(1), 11 (1997)

[2] Zweben C, Schmidt KA, Packaging of Electronic Materials Handbook, Materials Park, vol. 1, OH, ASM (1989) (1989)

[3] Lee JS, J. Kor. Powder Met., 4(1), 1 (1997)

[4] Kumar AH, Tummala RR, J. Met, 22, 10 (1992)

[5] Zweben C, J. Met., 44, 15 (1992)

[6] German RM, Hens KF, Johnson JL, Intern. J. Powder Metall., 30(2), 205 (1994)

[7] Fuchs S, Barnwell PG, Intern. J. Microcircuits Electronic Packaging, 20, 61 (1997)

[8] Benjamin JS, New Materials by Mechanical Alloying Techniques, ed. Arzt E, Schultz L, p. 3, Deutsche Gesellschaft fur Metallkunde, Oberursel (1989) (1989)

[9] Froes FH, J. Met., 41, 25 (1989)

[10] Benjamin JS, Metal Powder Report, 45, 122 (1990)

[11] Cullity BD, Elements of X-ray Diffraction, 2nd ed., p. 356, Addision-Wiesly Pub. Co Inc., New York (1978) (1978)

[12] Lee KM, Lee JS, Lee D, Kim SS, Ahn IS, Park MW, J. of Alloys and Compound, 313(1-2), 214 (2001)

[13] Hummel RE, Electronic Properties of Materials, 2nd Ed., p. 354, Springer-Verlag, USA (1994) (1994)

[14] Lee SI, Yoo MK, Moon 1H, Proceedings of the 2000 Intern. Conf. on P/M & Particulate Materials, 13 (2000)

[15] Kingery WD, J. Am. Ceram. Soc, 40, 351 (1957)