The low-temperature synthesis of electrical conductive copper films under an air atmosphere was successfully developed by thermal decomposition using copper-aminediol complexes. Ink-mixed copper(II) formate and various types of aminediols were coated onto glass substrates, which were then calcined in air at various temperatures. Copper-aminediol complex inks were calcined with either 3-dimethylamino-1,2-propanediol or 3-diethylamino-1,2-propanediol at 165-180 degrees C to produce films with electrical conductivity and a minimum surface resistivity of 02 Omega sq(-1). The film consisted of copper particles 1-3 mu m in diameter. Aminediol adsorbed onto the surface of copper particles in the film prevented attacks from oxygen. (C) 2014 Elsevier B.V. All rights reserved.