We already have published a report indicating that the ring current, i.e., the Cu+ ion concentration increases with the increase in the reverse current of a periodic reverse pulse current waveform by using a rotating ring disk electrode(RRDE). Furthermore, we have shown that the void decreases with an increase in the reverse current. However, the Cu+ ion concentration within the actual via is unknown. A one calculated dimensional diffusion model has been adapted in this study. Based on the Cu+ ion concentration within the via, the Cu+ ion concentration during dissolution is two orders higher if compared for that during the electrodeposition. The Cu+ ion concentration within the via increases with the increasing reverse current of a periodic reverse pulse current waveform. This calculated result corresponds for the published RRDE result. Furthermore, the Cu+ ion concentration at the via bottom increases during the off-time of a periodic reverse pulse current waveform. The Cu+ ion increases the current of the trench bottom electrode of through mask with three additives of PEG, SPS and Cl-. An increase in the Cu+ concentration at the via bottom is achieved by adopting the reverse current. (C) 2014 The Electrochemical Society. All rights reserved.