The recycling of waste printed circuit boards (PCBs) has become one of the global challenges in the technological era. The colossal volume of waste PCB generated annually coupled with its toxic nature and the existence of highly-precious metals in its composition intensifies the problems associated with waste PCB management and recycling. The two prevalent waste management options, landfill disposal and incineration, are being phased out for this special waste as a result of public health concerns. Hence, in the past few decades, several PCB recycling schemes are being introduced. The most efficient and environmentally-sound practice for waste PCB recycling has been the separation of metallic and nonmetallic fraction of PCBs by extensively-studied physico-mechanical approaches. Although the metallic fraction can be directly rendered into the market due to its high value, the nonmetallic fraction (NMF) is either disposed of in landfills causing secondary pollution or used as a low-value filler with the sole purpose of its safe disposal. This study presents a brief overview of the utilization of NMF as a filler in various industries. The main objective of the present review is to thoroughly examine the novel, highly efficient application of NMF as precursor for the production of a mesoporous structured adsorbent and its application in the removal of a myriad of heavy metals in single- and multi-component systems. In addition, the effects of the operational parameters on the adsorption behavior of the adsorbent material have been provided. Moreover, a comprehensive overview of the adsorption system modelling for single and binary-component systems for this novel material has been compiled. (C) 2014 Elsevier B.V. All rights reserved.