Tuning the wettability of various coating materials by simply controlling the deposition parameters is essential for various specific applications. In this work, carbon nitride (CN,) films were deposited on silicon (1 1 1) substrates using radio-frequency plasma enhanced chemical vapour deposition employing parallel plate electrode configuration. Effects of varying the electrode distance (DE) on the films' structure and bonding properties were investigated using Field emission scanning electron microscopy, Atomic force microscopy, Fourier transform infrared and X-ray photoemission spectroscopy. The wettability of the films was analyzed using water contact angle measurements. At high D-E, the CNx films' surface was smooth and uniform. This changed into fibrous nanostructures when D-E was decreased. Surface roughness of the films increased with this morphological transformation. Nitrogen incorporation increased with decrease in D-E which manifested the increase in both relative intensities of C=N to C=C and N H to O-H bonds. sp(2)-C to sp(3)-C ratio increased as D-E decreased due to greater deformation of sp(2) bonded carbon at lower D-E. The films' characteristics changed from hydrophilic to super-hydrophobic with the decrease in D-E. Roughness ratio, surface porosity and surface energy calculated from contact angle measurements were strongly dependent on the morphology, surface roughness and bonding properties of the films. (C) 2014 Elsevier B.V. All rights reserved.